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TEST RESEARCH INC TRI 7R7006L 3D Solder Paste Inspection Machine

TEST RESEARCH INC TRI 7R7006L 3D Solder Paste Inspection Machine

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The TEST RESEARCH INC TRI 7R7006L 3D Solder Paste Inspection Machine is a high-tech device designed for inspecting 3D solder paste on electronic components and printed circuit boards. This machine from the reputable brand Test Research Inc ensures precise and efficient inspection, helping to maintain quality control in electronic assembly processes. With advanced sensors and imaging technology, this machine is capable of detecting inconsistencies and defects in the solder paste, making it an essential tool for ensuring product reliability and performance.

Specification:
High speed 3D Solder paste inspection system
Board size: 18″ x 20″ (460 mm x 510 mm)
220V
The TR7006 three-dimensional Solder Paste Inspection System tester can quickly detect the thickness of every solder joint and any open or short circuits.
With this, the long-existing handicap with two-dimensional testing is solved. The System targets small products and prevents them from having bad connections as a result of small solder joints, lack of solder, component vibrations and heat expansions.
Main General Features:
• Ultra High Speed
• Immediate identification of Solder Paste Defects

Description

The TEST RESEARCH INC TRI 7R7006L 3D Solder Paste Inspection Machine is a high-tech device designed for inspecting 3D solder paste on electronic components and printed circuit boards. This machine from the reputable brand Test Research Inc ensures precise and efficient inspection, helping to maintain quality control in electronic assembly processes. With advanced sensors and imaging technology, this machine is capable of detecting inconsistencies and defects in the solder paste, making it an essential tool for ensuring product reliability and performance.

Specification:
High speed 3D Solder paste inspection system
Board size: 18″ x 20″ (460 mm x 510 mm)
220V
The TR7006 three-dimensional Solder Paste Inspection System tester can quickly detect the thickness of every solder joint and any open or short circuits.
With this, the long-existing handicap with two-dimensional testing is solved. The System targets small products and prevents them from having bad connections as a result of small solder joints, lack of solder, component vibrations and heat expansions.
Main General Features:
• Ultra High Speed
• Immediate identification of Solder Paste Defects